Quartz Wafer Tsabtace Jirgin ruwa
Kwale-kwalen wafer na ma'adini na'ura ce da ake amfani da ita don tsaftace wafer a cikin tsarin masana'antar semiconductor.
Abu: 99.99% quartz
Bayani
Siffofin
- High zafin jiki juriya
- Juriya na lalata
- Saka juriya
- Sauƙi don tsaftacewa
Amfani: cire gurɓataccen ƙasa
Tabbatar da ingancin masana'anta na guntuwar semiconductor.
Aikace-aikace
1. Pre{1}} Tsabtace Yaduwa
Ana amfani da shi don jigilar wafers ta cikin rigar benci ko matakan tsabtace nutsewa (misali, tsaftacewar RCA) don cire ƙwayoyin halitta, ƙarfe, da gurɓataccen gurɓataccen abu kafin haɓakar yanayin zafi ko matakan oxidation.
2. Buga{1}}CMP (Chemical Mechanical Planarization) Tsabtace
Rike wafers yayin post{0}yana goge goge don kawar da slurry da lahani na sama, yana tabbatar da mafi kyawu don matakan lithography na gaba.
3. Gaban -Ƙarshen{2}} na -Layi (FEOL) Ƙirƙira
An yi aiki da shi a cikin matakai masu tsafta na FEOL inda ake buƙatar tsaftataccen wuri mai tsafta don haɓakar gate oxide, jigon epitaxial, ko shigar da ion.
4. Baya{1}} Ƙare{2}} na{3}}Layi (BEOL) Gudanarwa
Yana goyan bayan wafers yayin post{0}}etch ko post{1}} tsaftacewa don cire photoresisist, etch byproducts, da ƙazantattun ƙarfe bayan haɗin haɗin gwiwa.
5. Babban Marufi
Yana sauƙaƙa wafer{0}} matakin tsaftacewa kafin dicing ko haɗawa cikin marufi na 2.5D/3D IC, yana tabbatar da gurɓatawa{3}}asashen kyauta don amintattun hanyoyin haɗin gwiwa.
6. Kayan Aikin Hoto
An yi amfani da shi a cikin samar da ƙwayoyin rana don tsaftace abubuwan siliki, haɓaka ingancin saman don ingantacciyar ɗaukar haske da ingantaccen canjin makamashi.
Kayayyaki
|
Abubuwan Jiki |
Darajoji |
|
Tsafta |
＞99.99% |
|
Yawan yawa |
2.2g/cm3 |
|
Bayyana gaskiya |
＞90% |
|
Mohs Hardness |
5.5--6.5 |
|
Wurin Lalacewa |
1280 digiri |
|
Wurin Tausasawa |
1750 digiri |
|
Annealing Point |
1250 digiri |
|
Takamaiman Zafi ({0}} digiri) |
670J/kg. digiri |
|
Thermal Conductivity (20 digiri) |
1.4W/m. digiri |
|
Haɓakar zafi (w/mk, digiri 1000) |
1.0-1.2 |
|
Fihirisar Refractive |
1.4585 |
|
Coefficient na Thermal Expansion |
5.510 -7cm/cm. digiri |
|
Zazzafi - mai aiki |
1750-2050 digiri |
|
Gajeren - zafin Sabis |
1450 digiri |
|
Dogon lokaci - Zazzabi na Sabis |
1100 digiri |
|
Abubuwan Sinadarai |
Darajoji |
|
Acid resistant |
Acid mai ƙarfi (sai dai HF), alkali mai ƙarfi, maganin kwayoyin halitta |
|
Babban yanayin zafi Mai jure lalata |
Madalla |
|
Ƙarfe Najasa Abun ciki |
ku 5ppm |
|
Abubuwan Lantarki |
Darajoji |
|
Resistivity |
7107Ω.cm |
|
Ƙarfin Insulation |
250 ~ 400Kv/cm |
|
Dielectric Constant |
3.7~3.9 |
|
Dielectric Absorption Coefficient |
＜410-4 |
|
Dielectric Loss Coefficient |
＜110-4 |
|
Kayayyakin Injini |
Darajoji |
|
Ƙarfin Ƙarfi |
1100MPa |
|
Lankwasawa Ƙarfin |
67MPa |
|
Ƙarfin Ƙarfin Ƙarfi |
48MPa |
|
Rabon Poisson |
0.14~0.17 |
|
Modul na Matasa |
72000MPa |
|
Modulus Shear |
31000MPa |
Hanyoyin tsaftacewa
Tsabtace nutsewa:
Sanya wafer a cikin jirgin ruwa mai tsabta, sa'an nan kuma nutsar da jirgin ruwa mai tsabta a cikin ruwa mai tsaftacewa, kuma ƙara yawan hulɗar tsakanin ruwan tsaftacewa da farfajiyar wafer ta hanyar ɗaga jirgin ruwan wafer don inganta aikin tsaftacewa.
Tsabtace fesa:
Tsaya jirgin ruwan tsaftacewa a tsaye a cikin ɗakin feshin, kuma yi amfani da bututun ruwa don fesa ruwan tsaftacewa a saman wafer don cire gurɓataccen abu. da
Muhimmancin tsabtace jiragen ruwa:
- Tabbatar da tsaftar wafer: Tsaftataccen shimfidar wafer yana da mahimmanci ga ƙirar ƙira na kwakwalwan kwamfuta, kuma kwale-kwalen tsaftacewa yana taka muhimmiyar rawa a aikin tsaftacewa.
- Tabbatar da amincin kwakwalwan kwamfuta na semiconductor: Tabbatar da amincin kwakwalwan kwamfuta da rage lahani na samfur ta hanyar cire gurɓataccen ƙasa.
- Inganta yawan amfanin guntu na semiconductor: Inganta tsaftar wafers, ta haka inganta yawan amfanin guntu na semiconductor.
Hot Tags: ma'adini wafer tsaftacewa jirgin ruwan, China ma'adini wafer tsabtace jirgin ruwa masana'antun, masu kaya, masana'anta
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